Forward cooling headlight

ABSTRACT

There is disclosed a forward cooling headlight comprising a body, a lens coupled to the body and a heatsink coupled to the body. There is also a heatpipe and at least one light. The light is coupled to the heatsink, wherein the heatpipe is coupled to the heatsink at a first end, and to the body at a second end. The heatsink draws heat away from the light, via the heatpipe and towards the body. There can be at least one synthetic jet coupled to the heatpipe to aid in cooling the light. In addition, in at least one embodiment, there can be at least two lights with at least two different drivers with a first driver driving a first light and a second driver driving a second light wherein when each of the lights is lit it is capable of generating a different focal point.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation in part application of U.S. patentapplication Ser. No. 17/481,194 filed on Sep. 21, 2021, which is anon-provisional application of U.S. Provisional Application Ser. No.63/081,288 filed on Sep. 21, 2020, the disclosure of these applicationsare hereby incorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

At least one embodiment of the invention relates to a headlight thattransfers all or much of the heat generated by the LED Light Engine tothe front of the headlight, and dissipates such heat to the environmentusing a finned circular heatsink located in front of the light, suchheat is used to melt ice or snow build up, and or evaporate moisturenormally deposited in front of the headlight by unusual of severeweather conditions. Imbedded Heat pipes are used to transfer the heatfrom the LED Light Engine to the finned circular heatsink, allowing theheadlights to normally illuminate the front of the vehicle under extremeweather conditions, during dub-zero temperatures and high windconditions, an imbedded heater inside the front heatsink can generateadditional heat and maintain the lens above freezing temperatures, freeof ice, snow and moisture, always maintaining the lens with clearvisibility and always allowing for maximum light output. Headlights forvehicles such as trains, trucks, airplanes, boats, cars or othervehicles are subject to illumination obstructions such as moisture, iceand snow.

SUMMARY OF THE INVENTION

One embodiment of the invention relates to aforward-cooling/self-deicing light comprising a body and a cover coupledto the body. Disposed inside of the cover and the body is at least onecircuit board and at least one LED, wherein the LED is in communicationwith the circuit board. There is also at least one heat transfer devicedisposed in the body wherein the heat transfer device is configured totransfer heat from one component to another component where one islocated inside the body, and another is located outside of the body.There is also at least one temperature sensor disposed in the body,wherein the temperature sensor configured to determine a temperatureinside of the body of the light. There is also at least one heatingelement configured to generate heat around the perimeter of the front ofthe headlight wherein the heating element is coupled to the frontcircular heatsink which is coupled to the body. There is also at leastone switch, configured to provide power to the heating element when thetemperature sensor determines that the temperature inside of the lightbody is below a predetermined temperature

SUMMARY OF THE INVENTION

One embodiment of the invention relates to a forward LED cooling & lensdeicing LED light comprising of a body and a heatsink cover coupled tothe body.

Disposed inside of the cover and the body of the LED light is at leastone circuit board, at least one LED, and at least one heat transferdevice located behind the LED, used to quickly move to the heatgenerated by the LED to the heatsink cover, preventing a thermal runawaycondition experienced when High intensity LEDs are operating at fulloutput capacity.

One benefit of the invention is that it allows for remote heatsinking,which involves bringing heat from LEDs directly in touch with theenvironment, thus, it increases the heat transfer surface area to morethan 10-fold.

The embodiment uses a heatsink cover coupled with a heat transfer deviceto distribute the heat generated at the bottom of LED about the muchlarger area of the heatsink cover. The heatsink cover is located in theoutside of its mounting fixtures and in direct contact with theenvironment. The rear housing separates LED heat from circuit boardheat, can be designed to dissipate greater amount of heat by increasingheatsink fin configuration.

One embodiment uses a rear housing which provides additional heatsinkingfor medium and light intensity applications. The back of housing hasfins that are dedicated for the cooling of the driver board and canprovide additional cooling with fins on its side when a high intensityapplication requires them.

The design of the heat pipes are such that they are additional heattransfer devices with circular shaped heat transfer device which is ableto transfer heat away from the LEDs at a very fast rate and distributesuch heat uniformly about a circular heatsink.

Thus, this embodiment uses the heat transfer device for two purposes,first, to remove the heat generated by the LED, and transporting it tothe heatsink cover in front of the light, to melt ice buildup andevaporate moisture normally deposited in the front of the LED lightduring a wet, snowy, or icy day.

The LED driver controls light intensity, and heater to melt or evaporateany snow, ice, or moisture build up in the form of the light.

There is also a multifunctional dual channel LED driver board disposedin the body wherein the device is configured to drive the LEDsindependently, control the intensity of the LED, and monitor the LED'sfunctions and thermal conditions.

There is also at least one temperature sensor disposed in the body ofthe circuit board, wherein the temperature sensor is configured todetermine a temperature of the circuit board which is correlated thetemperature of heatsink cover.

, The heating element is strategically located inside the LED mountingblock which stabilizes temperature signature during sub-zero degreeweather and maintains such temperature until severe weather is no longerpresent.

There is also at least one heating element coupled to one end of theheat transfer devise configured to generate additional heat inside thebody of heat transfer device when then capacity of the heat generated bythe LEDs in not enough to remove the snow, and ice deposited in theheatsink cover.

In at least one embodiment, a mounting apparatus that mounts the heattransfer devices and the LEDs in many configuration with passage ways tofor the heat transfer device conduit heat toward the front heatsinkcover.

The is also at least one LED/Mounting tombstone configured to provide amounting platform for the LEDs board, and the heat transfer devises. Thetombstones are further configured to allow many LED mountingconfigurations which depend on the requirements of the LED light.

In addition, the lens design allows for use in combination with facettedor parabolic reflectors and can be prismatic or smooth shape withinternal nano particles that increase the temperature of the lens,taking advantage of the radiative heat generated by the LEDs.

There is also at least one lens configured to protect the inside of thebody of the light. The invention also provides for the lens to bereconfigured with prismatic shapes that will split the light beam inmany directions for the purposes meeting certain light footprintrequirements as required by industry lighting standards. Another featureof this invention is to impregnate nano steel particles into the lensfor the purposes of using the radiated light to heat up the lens and aidin the melting of the ice, snow, and evaporating moisture from the formof the light.

There is also facetted and parabolic reflector can be used to satisfydifferent applications.

There are also within the body of the light, provisions for the usemultiple reflectors. There are at least to types of reflectors: facettedand parabolic. These reflectors provide different light focusingattributes used in a multitude of applications.

There is also at least one power contact coupled to the body of thelight, wherein the power contact is configured to receive power into thebody of the light: For example, power goes into the LED driver.

Power is fed into the two LED Drivers which are configured to regulatethe input power (Voltage and Current) and deliver regulated power toLEDs. next, the LEDs light up, generating high intensity light and largeamount of heat. The heat transfer device immediately moves the heat fromthe LEDs to the to the heatsink cover. The temperature of the board ismonitored by the temperature sensor inside the circuit board. If thetemperature of the board is not about a above zero water the circuitboard will turn “ON” the heater and add addition heat until the anysnow, ice, or moisture is evaporated from the front of the light. Oncethe Temperature senses that the temperature reaches a predeterminedtemperature, the heater will be turn “OFF” by a signal coming fromcircuit board. The board will keep monitoring the temperature andmaintain it at a predetermine value until such time that the severe coldweather conditions get warmer.

The heatsink cover is configured so that it has groves where the heattransfer devices are mounted. The heat transfer device deposits the heatcoming from the LEDs around the circular fins located around itsperimeter. The heat is then dissipated by the heatsink cover fins.

The regulating LED driver board operation is such that when thetemperature is below zero ice, the driver board allows more current toflow into the LEDs for the purposes of generation more heat. The heatfrom the LEDs is moved to the heatsink cover for the purposes of meltingany ice or moisture build up in the heatsink cover. If the sensor sensesthat the temperature in the driver board is below zero, the driver boardincreases the power to the LEDs until such time that the junctiontemperature of the regulator is above zero ice. If he temperature stilldoes not sense a higher temperature higher than zero-ice, In addition,the driver board will allow the solid-state switch to open and sendpower to the heater, until such time that the temperature on the driverboard is higher than zero-ice.

Thus, there is created a smart headlamp which is configured to both actas a light and as a de-icer.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other benefits and features of the present invention willbecome apparent from the following detailed description considered inconnection with the accompanying drawings. It is to be understood,however, that the drawings are designed as an illustration only and notas a definition of the limits of the invention.

In the drawings, wherein similar reference characters denote similarelements throughout the several views:

FIG. 1 shows an exploded view of a first embodiment of the invention;

FIG. 2 a shows a bottom perspective view of the embodiment shown in FIG.1

FIG. 2B is a top view of the light;

FIG. 2C is a first side view of the light;

FIG. 2D is another side view of the light;

FIG. 2E is a bottom perspective view of the light;

FIG. 3 a is an exploded view of the heatsink;

FIG. 3B shows a perspective view of the heat pipe;

FIG. 3C shows a perspective view of the heatsink body;

FIG. 4 is a side view of the first embodiment;

FIG. 5 a is a top cross-sectional view taken along the line C-C shown inFIG. 4 ;

FIG. 5B is a side cross-sectional view taken along line A-A shown inFIG. 4 ;

FIG. 6A a is a bottom perspective view of the heatsink;

FIG. 6B is a top perspective view of the hate heatsink;

FIG. 6C is a side cross-sectional view taken along section line C-C ofthe heatsink;

FIG. 7 is a cross-sectional view taken along line B-B shown in FIG. 4 ;

FIG. 8A a is a side cross-sectional view taken along the line

FIG. 8B is a detail view of detail D shown in FIG. 8 a;

FIG. 9 is a cross-sectional view of the light;

FIG. 10A is a first detailed view of a connection between the body, theheatsink and the cover;

FIG. 10B is a cross-sectional view of the light;

FIG. 10C is another detail view of the light, particularly theconnection between the heat sink and the body;

FIG. 10D is a is a detail view of the connection between the heat sinkand the body;

FIG. 11A is a side view of the heat sink with the heat pipes;

FIG. 11B is a side view of the contact for the heat sink

FIG. 11C is a side view of the connection between the circuit board andthe body;

FIG. 12A is a side view of the contacts for powering the circuit board;

FIG. 12B is another side view of the contacts in communication with thecircuit board;

FIG. 13A is a perspective view of the body of the heat sink;

FIG. 13B is another perspective view of the body of the heat sink;

FIG. 13C is an exploded perspective view of the heat sink;

FIG. 14A is a perspective view of the body of the light;

FIG. 14B is a top view of the body of the light showing section lineA-A;

FIG. 14C is a cross-sectional view of the body taken along section lineA-A;

FIG. 15A is a perspective view of the contact block for the light;

FIG. 15B is a top view of the contact block for the light having sectionline A-A shown therein;

FIG. 15C is a side cross-sectional view taken along line A-A;

FIG. 16A is a perspective view of the lens;

FIG. 16B is a front side view of the lens;

FIG. 16C is a detail view of the lens;

FIG. 16D is a side cross-sectional view of the lens taken along line A-Ashown in FIG. 16B:

FIG. 17 is a top view of the light with the cover or lens removed;

FIG. 18A is a perspective view of one of the reflectors;

FIG. 18B is an end-perspective view of the reflector of FIG. 18A; and

FIG. 18C is a side view of the reflector of FIG. 18A.

FIG. 19 is an exploded view of another embodiment;

FIG. 20A is a bottom view with cross-section lines A-A, B-B, and C-Ctherein;

FIG. 20B is a first cross-section taken along the lines A-A;

FIG. 21A is a cross-section taken along the line B-B;

FIG. 21B is a cross-section taken along the line C-C;

FIG. 22A is a bottom perspective view of a reflector body;

FIG. 22B is a top perspective view of the reflector body;

FIG. 22C is a top view of the heat sink which includes a reflector;

FIG. 22D is the back side view of the heat sink of FIG. 22C;

FIG. 23A is a perspective view of a cross section of the embodiment ofFIG. 19 ;

FIG. 23B is a perspective view of a quarter taken out of the embodimentof FIG. 19 ;

FIG. 23C is another top perspective view of the embodiment of FIG. 19 ;

FIG. 24 is a perspective view of a heat sink plate and LED;

FIG. 25A is a first top perspective view of another heat sink;

FIG. 25B is a bottom perspective view of the heat sink;

FIG. 25C is another perspective view of the heat sink;

FIG. 25D is a bottom perspective view of the heat sink;

FIG. 26A is a first perspective view of the heat pipe;

FIG. 26B is a side view of the heat pipe;

FIG. 26C is a top view of the heat pipe;

FIG. 27 is a perspective view of the two heat pipes;

FIG. 28 is an exploded three-dimensional view of the embodiment of FIG.19 ;

FIG. 29A is a bottom perspective view of a reflector of a newembodiment;

FIG. 29B is a top perspective view of the reflector of FIG. 29A;

FIG. 30A is a bottom perspective view of the heat sink of the thirdembodiment;

FIG. 30B is a top perspective view of the heat sink of the thirdembodiment;

FIG. 31A is a bottom perspective view of the LED lights on theirmounting plate;

FIG. 31B is a top perspective view of the LED lights on their mountingplate;

FIG. 32 is a perspective view of the four heat pipes;

FIG. 33A is a bottom view of the lens;

FIG. 33B is a top view of the lens;

FIG. 34A is a perspective view of a first set of contacts;

FIG. 34B is a perspective view of a second set of contacts;

FIG. 35A is a side view of a first body for the light;

FIG. 35B is a side view of a second body for the light;

FIG. 36A is a perspective view of a first flow pattern for a heat pipe;

FIG. 36B is a perspective view of a second flow pattern for a heat pipe;

FIG. 37A is a perspective view of a first set of heat pipes;

FIG. 37B is a perspective view of a second set of heat pipes;

FIG. 37C is a perspective view of a third set of heat pipes;

FIG. 38A is a front perspective view of the reflective pattern of areflector;

FIG. 38B is a front perspective view of a reflective pattern of anotherreflector;

FIG. 39A is a top perspective view of a front heat sink;

FIG. 39B is a front view a of a front heat sink;

FIG. 40A is a front perspective view of a back heat sink;

FIG. 40B is a side view of a back heat sink;

FIG. 41A is a perspective view of a LED mount;

FIG. 41B is a perspective view of another LED mount;

FIG. 41C is a perspective view of another LED mount;

FIG. 42A is a front-side perspective view of a heat sink;

FIG. 42B is a back-side perspective view of a heat sink;

FIG. 42C is a front-side perspective view of a second heat sink;

FIG. 42D is a back-side perspective view of the second heat sink;

FIG. 43A is a side view of a lens;

FIG. 43B is another side view of the lens of FIG. 43A;

FIG. 43C is a side view of a lens;

FIG. 43D is another side view of the lens;

FIG. 44A is a side cross-sectional view of a lens;

FIG. 44B is a side view of the lens of FIG. 44B;

FIG. 44C is a front view of another lens;

FIG. 44D is a side view of the lens;

FIG. 44E is a front view of another lens;

FIG. 44F is a side perspective view of another lens;

FIG. 45 is a front view of another headlight;

FIG. 46 is a perspective view of the headlight of FIG. 45 ;

FIG. 47 is a side view of the headlight of FIG. 45 ;

FIG. 48 is a side view of the headlight of FIG. 45 ;

FIG. 49A is a block diagram of an electrical system for a headlight;

FIG. 49B is a block diagram of an electrical system for a headlight;

FIG. 50 is another block diagram for the electrical system for theheadlight;

FIG. 51 is another block diagram for the electrical system for theheadlight;

FIG. 52 is another block diagram for the electrical system for theheadlight;

FIG. 53 is another block diagram for the electrical system for theheadlight;

FIG. 54 is another block diagram for the electrical system for theheadlight;

FIG. 55 is another block diagram for the electrical system for theheadlight; and

FIG. 56 is a flow chart for the process for heating the headlight;

FIG. 57 is an exploded view of another embodiment of a headlight;

FIG. 58A shows a side exploded view of the headlight of FIG. 57 ;

FIG. 58B shows a side view of the assembled headlight of FIG. 57 ;

FIG. 58C shows a top perspective view of the assembled headlight of FIG.57 ;

FIG. 59 is a bottom view of the headlight of FIG. 57 ;

FIG. 60A is a side cross-sectional view of the headlight of FIG. 57taken along line A-A of FIG. 59 ;

FIG. 60B is a side cross-sectional view of the headlight taken alongsection line B-B;

FIG. 60C is a side cross-sectional view of the headlight taken alongsection C-C;

FIG. 61A is a close-up detailed view of a section of the embodiment ofFIG. 57 ;

FIG. 61B is a close up detailed sectional view of the embodiment of FIG.57 ;

FIG. 62 is a side view of the embodiment shown in FIG. 57 ;

FIG. 63 is a side exploded perspective sectional view of the embodimentshown in FIG. 57 ;

FIG. 64 is a side sectional view of the embodiment shown in FIG. 57 ;

FIG. 65A is a side exploded view of a tombstone heat sink with a light;

FIG. 65B is an assembled side top perspective view of the heatsink ofFIG. 65A;

FIG. 66A is a side view of the heatsink of FIG. 65A;

FIG. 66B is a top view of the heat sink of FIG.65A;

FIG. 66C is a side assembled view of the heat sink of FIG. 65A;

FIG. 66D is a bottom assembled view of the heat sink of FIG. 65A;

FIG. 67 is a perspective view of another embodiment of a headlight;

FIG. 68A is a side cross sectional view taken along section line B-B ofthe light of FIG. 67 ;

FIG. 68B shows a detailed view of the light in detail G showing thelens;

FIG. 69 is a side perspective view of heat pipes and motherboardassembly coupled to the circular heat sink;

FIG. 70 is a perspective view of the headlight of FIG. 67 with the lensremoved;

FIG. 71 is a side perspective cut-away view of the headlight of FIG. 67

FIG. 72A is a side perspective exploded view of a first heat sinkassembly for a LED light;

FIG. 72B is a side perspective assembled view of the heat sink assembly;

FIG. 73A is a side exploded view of another heat sink assembly;

FIG. 73B is an assembled view of the embodiment of FIG. 73A;

FIG. 74A is a side view of another embodiment which shows a side view ofa first embodiment which is projecting light to a single focal point;

FIG. 74B is a side view of another embodiment which projecting lightonto two focal points;

FIG. 75 is an electrical block diagram of dual driver circuit boardwhich are independently energizing two LED arrays that reside on each ofthe two boards;

FIG. 76 is a three-dimensional view of the embodiment shown in FIGS. 74Aand 74B;

FIG. 77 is a back perspective view of another embodiment havingsynthetic jets;

FIG. 78 is a back perspective view of the embodiment shown in FIG. 77 ,wherein this view has synthetic jets;

FIG. 79 is a back perspective view of the embodiment of FIG. 77 withoutthe circuit boards being attached;

FIG. 80 is a back perspective view of the embodiment of FIG. 77 with thecircuit boards attached;

FIG. 81 is a perspective view of heatpipes, heatsinks and synthetic jetswherein the heatpipes have fluid disposed therein;

FIG. 82 is a side view of a synthetic jet;

FIG. 83 is a perspective view of another embodiment having an additionalheatsink;

FIG. 84 is another embodiment which shows a front perspective view ofthe embodiment shown in FIG. 83 ;

FIG. 85A is a view of a dual synthetic jet shown in FIGS. 83 and 84 ;

FIG. 85B shows the underside of the dual synthetic jet in an explodedview;

FIG. 85C is a transparent view of the dual synthetic jet;

FIG. 85D is a side cross-sectional view taken along line A-A of FIG. 85Cwith the bladders unmoved; and

FIG. 85E is a side cross-sectional view taken along line A-A with thebladders being inflated and deflated.

DETAILED DESCRIPTION

FIG. 1 shows an exploded view of a first embodiment of the inventionwherein in this view there is a first embodiment of a light 10 acomprising a circuit board 1 which can comprise a printed circuit boardor PCB. In addition to a main printed circuit board there are additionalcircuit boards or plates 606 and 611. Each of these additional printedcircuit boards 602 and 614 include lights or LEDs which are disposedthereon. There is also a block or pole mount 3 disposed towards one endof the light. At least one heat pipe 4 is shown, wherein in this casethere are two heat pipes shown. The heat pipes can be known as heatpipes 401 and 402 shown in greater detail in FIG. 3A.

A heatsink base 5 is shown having a frusto-conical shape or asubstantially dome shape. This base has a plurality of fins and is shownin greater detail in FIGS. 2A-2E.

A heatsink center or heatsink block 6 is shown which is configured toconnect to a first end of the heat pipes 4 such as heat pipes 401 and402. A second heat sink or heat sink ring 7 is formed to be coupled tothe heat pipes 4 as well. With this design, the heat pipes move heatfrom the heat sink block 6 to the heat sink ring 7.

A lens 9 is shown, which is configured to be coupled to the heat sinkring 7. Lens 9 is shown in greater detail in FIGS. 16A-16D. A plateblocker 725 is also shown coupled to the heat sink ring 7. A pluralityof reflectors 11 and 12 are disposed inside of the heatsink base or body5. The heatsink base or body 5 along with the lens 9 and the heat sinkring form an enclosure for the components disposed therein. A pluralityof screws 13-18 are configured to fix the components together while aplurality of prongs 502 a and 502 b extend outside of the housing. Inaddition, there are a plurality of washers 20, 21, 23, and 24 along withat least one spacer 22.

FIGS. 2A, 2B, 2C, 2D and 2E show the various orientations of theenclosure of the light including the base or body 5 comprising a flangesection 504, a body section 503 having fins, a lower ring section 507,and a plurality of prongs 502 a and 502 b. In addition, coupled to theflange section 504 is the heat sink ring 7 comprising outer ring portionof body section 701.

FIG. 3 a is an exploded view of the heatsink, which shows a heat sinkblock 6 having a heat sink body 601 and two different heat pipes 401 and402 disposed therein. Each of the heat pipes 401 and 402 fit into a heatsink body 601. The heat sink body is coupled to respective LED circuitboards such as board 614.

FIG. 3B shows a perspective view of the heat pipe. The heat pipe 401includes a first bend section 4011 a second bend 4012 which is asubstantially 90 degree or right-angle bend, and a straight section4013, as well as another bend section 4014 and bend which isapproximately a 90 degree or right-angle bend, as well as anotherstraight section 4015 as well. This heat pipe occupies at least twodifferent planes and extends across at least two different levels in thelight because it is configured to carry heat from at least one heat sinkto another heat sink such as heat sink 6 as well as heat sink ring 7. Inat least one embodiment, the heat pipe is configured to transfer heatfrom heat sink 6 to heat sinks 5 and 7.

FIG. 3C shows a perspective view of the heatsink block 6 which includesa body section 601 as well as heat sink channels 607 and 610. These heatsink channels are configured to receive the heat pipes such as heatpipes 401 and 402. There is also a circuit board 614 which is coupled toa heat sink plate such as heat sink plates 606 and 611. A plurality ofscrews such as screws 608, 609 are used to connect the heat sink plates606 and 611 to the heat sink body such as body 601.

FIG. 4 is a side view of the first embodiment which shows variouscross-sectional lines cutting through and across this device includingcross-sectional lines A-A, B-B, C-C.

FIG. 5 a is a top cross-sectional view taken along the line C-C shown inFIG. 4 . With this view, there is shown heat pipes 401 and 402. The heatpipes extend away from heat sink block 601 which support LED lights.There are also a plurality of LED's 621, 612, and 613 which are coupledto an upper heat block 610. There is also a dome 25 which is also shownadjacent to LED lights 621, 612, and 613. In addition, there is alsoshown an outer rim 902 as well which is shown. This outer rim 902 isconfigured to be coupled to heat sink ring 7.

FIG. 5B is a side cross-sectional view taken along line A-A shown inFIG. 4 . In this view there is shown lens 901 which is positioned abovea dome lens 25 as well. Lens 901 is connected to ring heat sink bodysection 701, which is coupled to body 501. Below the dome are lightssuch as LED lights 621, 612, and 613. In addition, heat pipes 401 and402 are shown coupled to heat sink body 601 as well. A plurality of LEDLights on a light plate 619 are shown as lights 616, 617, and 618. Anadditional light plate 620 includes lights 621, 622, and 623 as well.Positioned adjacent to the LED lights are reflectors 1101 and 1201 whichare semi-dome shaped and which are configured to reflect light from LEDLights such as lights 616, 617, 618 as well as lights 621, 622, and 623.The LED lights and reflectors are disposed inside of the lens 9 such aslens body 901 and the body such as body or base 501. Body 501 alsoincludes fins 509 which are used to increase the surface area, and whichis used to allow for greater heat transfer between the heat inside andthe heat outside of the enclosure (enclosure formed by base 5 heat sinkring 7 and lens 9 together) as well as inside of the enclosure. A polemount body 304 for a pole mount is configured to receive contacts orprongs 502 a and 502 b which provide power into the circuit board 109via contact screws 310, and 312. Another contact screw 311 is also shownconnecting into the pole mount body 304.

FIG. 6A a is a bottom perspective view of the heatsink, wherein there isshown heat sink ring 7 which has a body section 701, which has an innerrim section 702 and an outer rim section 703. a bridge 704 is shownextending between two different parts of the outer rim section 703.There are tracks or channels 705 and 706 which are configured to receiveheat pipes as well. In addition, channels 707 and 708 are alsoconfigured to receive the heat pipes as well. There is also a shelfsection 709 as well.

FIG. 6B shows a top side of the ring-shaped heat sink wherein there isshown bridge 704, as well as shelf section 709 a top rim 710 configuredto receive an inner portion of lens 9, and an outer rim 711 which isconfigured to connect to body 5. There are holes 712 and 713 which areconfigured to receive lights such as LED lights which extend throughthese holes 712 and 713.

FIG. 6C is a side cross-sectional view taken along section line C-C ofthe heatsink. In this view there is shown channels 707 and 708 as wellas fin 714 and rim 711.

FIG. 7 is a cross-sectional view taken along line B-B shown in FIG. 4 ;In this view there is shown printed circuit board or motherboard orcircuit board 1 which includes a motherboard section 109, a processor101, a memory 102, a temperature sensor such as input or sensors 103 aand 103 b, transistors 104 a and 104 b which are configured to switch onor off lights or a heating element, a power supply or power input 105which is coupled electrically to prongs 502 a and 502 b, an input/outputI/O port 107, a first feed 108 to the lights and a second feed 110 tothe heating element (see heating element 625 (FIG. 13A), heating element3511 (See FIG. 25D) or heating element 4114 (see FIG. 30B)).

FIG. 8A is a side cross-sectional view taken along section line A-A inFIG. 4 . In this view there is shown lens body 901, an outer rim 902,and across lens 903 of lens 9. Outer rim 902 is coupled to outer ringsection 701. Outer ring section 701 is coupled to body section 501. Heatpipes 401 and 402 are coupled to heatsink 601 at one end and heatsinkring 7 having body section 701 at the other end. In addition, coupled toheatsink ring 7 having body section 701 are semi-dome shaped reflectors1201, and 1101. Body section 5 extends down to ring section 507. Coupledto ring section 507 is circuit board 109. Coupled to flange region orring section 507 is pole mount 3 having pole mount body 304. Coupledpole mount body 304 are contacts 502 a and 502 b. A plurality of screwssuch as screws 310 311 and 312 are used for coupling to pole mount body304.

FIG. 8B is a detail view of detail D shown in FIG. 8A wherein in thisview there is shown body section 701 in contact with flange section 504of body 5. In addition, there is also shown heat pipe 401 which iscoupled to body section 701 forming an outer ring portion. In addition,there is also shown dome-shaped reflector 1201.

FIG. 9A is a cross-sectional view of the light. In this view there isshown lens body 901 having cross lens 903 wherein lens body 901 iscoupled to a body section 701. Reflectors 1201 and 1101 are disposed inheat sink ring 7 and inside the enclosure of body 5 heat sink ring 7 andlens 9. In addition, disposed between these reflectors 1101 and 1201 isheatsink body 601. Coupled to ring-shaped heatsink 7 is screw contact634. A plate blocker 725 is coupled to screw contact 634. Anothercontact 626 is disposed on heat sink body 6 wherein plate blocker 725 isformed as a leaf spring which is configured to rotate into contact 626.As shown coupled to flange section 507 is circuit board 109 whereincoupled to circuit board 109 is pole mount 3 and at least one contact orprong 502 a. Thus, when the light is plugged in, contact or prong 502 ais charged with power and this power then feeds into circuit board 109which then provides regulated power to the rest of the light.

FIG. 9B is a cross sectional view of the light being positioned insideof a light housing such as light housing 1501 which can be positionedinside of a vehicle such as a motor vehicle, a train a plane, a boat orother design.

FIG. 10A is a detailed view of a connection between the body 5, the heatsink 7 and the lens 9. In this view there is outer rim section 703 whichis coupled to base or body 501 via a screw 515. The base or body ispositioned inside of a light housing 1501 which includes an outersupport region 1504. A screw 514 is configured to couple a dome shapedreflector such as any one of reflector 1201 or 1101 to body 501.

FIG. 10B is a cross-sectional view of the light taken along line B-Bwhich shows reflectors 1101 and 1201 positioned inside of the body andwhich also shows heat sink body 601 as well as screws such as screw 514for securing these reflectors to the body 501, this is shown in greaterdetail in detail F of FIG. 10D. FIG. 10C shows detail D which shows acloser up view of detail E of FIG. 10A which shows screw 515 connectingouter flange 703 to body 501 and also shows a connection of outer rim902 of lens 9 to the outer flange 703. As shown the body

FIG. 11A is a side view of the heat sink with the heat pipes. In thisview, there is shown screws 634 and 633 which are configured to clampthe cross brace 704 of heat sink ring 7 to heat sink body 6 with heatpipes 401 and 402 extending between them. The heat pipes 401 and 402 arepositioned inside of respective channels 602 and 603 of heat sink block601 and are separated by section 605.

FIG. 11B is a side view of the contact for the heat sink which showscontact 626 configured to be contacted by plate blocker 725.

FIG. 11C is a side view of the connection between the motherboard andthe body shown by detail E of FIG. 8A. In this view motherboard 109 iscoupled to ring section 507 via a screw 117. In addition, a pole mountbody 304 is shown coupled to screw 310 which is then coupled to anassociated prong or contact.

FIGS. 12A and 12B show cross-sectional views of the connection between aprong or contact 502 a and the screw 310 as well as extending contact319 into motherboard 109 through ring section 507. In this way powerextending from the prong can reach the motherboard 109 inside of thehousing.

FIG. 13A is a perspective view of the body of the heat sink, in thisview there is a heat sink body which has heat sink plates 606 and 611.The heat sink body 601 includes channels 604 and 605 which are separatedby a dividing portion of the body 603. Plates 606 and 611 are configuredto contain LED circuit boards 602 and 614 (See FIG. 13B). Channels 604and 605 extend into a curved region 607 and 610 which are also separatedby a dividing portion of the body 603. A plurality of screw holes 627,628, 629, and 630 are configured to receive a plurality of screws 608,609, 635 and 636. These screws are configured to couple the plates 606and 611 to the block 601 as shown in exploded view of FIG. 13C. FIG. 13Aalso shows an optional heater element 625 such as a resister which canbe heated via an electric charge coming from circuit board 1 which heatsheater 625 up and then sends heat through the associated heat pipes toheat up the light without having to light the associated LED lights up.In this way, less power is required to heat the light when a user onlydesires to heat the lamp or light body up such as the region insidebetween base or body 5 and lens 9.

FIG. 14A is a perspective view of the body of the light with this viewthere is shown a rim section 504, a bottom section 513, and inner sidewalls 515. There is a shelf 516 which includes screw holes 514 which areconfigured to receive screws for coupling the base to the reflectors 11and 12 (See FIG. 1 ). There are also channels 510, 511 and 512 which areset into a bottom face 513, and an outer rim 516 which is configured tobe coupled to heat sink ring 7.

FIG. 14B is a top view of the body of the light showing section lineA-A; in this view channels 510, 511 and 512 are shown in bottom face513.

FIG. 14C is a cross-sectional view of the body taken along section lineA-A which shows channels 510, 511 and 512 disposed in ring section 507of base 5. Base or body 5 includes fins 503 as well as flange section504.

FIG. 15A is a perspective view of the pole mount 3 for the light whereinthis contact block includes a block body 304, a plurality of holes 301,302, and 303 as well as rims 305 and 306. The contacts or prongs 502 aare configured to fit through contact holes 301 and 303. FIG. 15B showsthe top view of this contact body 304 having holes 301, 302, and 303.FIG. 15C is a side cross-sectional view taken along line A-A which showsholes 301 and 303 for receiving contacts as well as hole 302 forreceiving a fastener such as a screw to lock the pole mount body 304 tothe base.

FIGS. 16A and 16B are respectively a perspective view and a top view ofthe lens 9. In this view there is shown a lens body 901 and an outer rim902. FIG. 16C shows a side cross-sectional view of the lens taken alongline A-A shown in FIG. 16B: This view shows lens body 901, and outer rim902. It also shows inner rim 903 as well. FIG. 16D shows a detail viewwhich shows a detailed view of the outer rim 902 and the inner rim 903.The outer rim 902 is configured to mesh with the heat sink ring 7 whenthe device is assembled.

FIG. 17 is a top view of the light with the cover or lens removed. Inthis view there is shown heat sink ring 7 with reflectors 1101 and 1201disposed therein. With this view there is shown body section 701 havingbridge 704 which channels 705, 706, 707, and 708. There are also shelfsections 1109 and 1209 of the respective reflectors. Disposed in thebody section 701 are reflectors 1101 and 1201. These reflectors areshown in greater detail in FIGS. 18A-18C.

FIG. 18A is a perspective view of one of the reflectors; 1101 whichincludes a shelf section 1109, body portion 1110 a rim 1111. There isalso a separate face 1113 positioned transverse to shelf section 1109.FIG. 18B is an end-perspective view of the reflector of FIG. 18A, whichshows rim 1111, body 1110, and rim 1114. FIG. 18C is a side view of thereflector of FIG. 18A, which shows rim 1111 as well as body section1110.

FIG. 19 is an exploded perspective view of a second embodiment, whereinthis view shows light embodiment 10 a having base 5 a at one end andlens 9 at the opposite end. A plurality of LED plates 611 and 606housing associated LEDs are coupled to a heat sink 35. Heat sink 35 ispositioned inside of base 5 a. A heat sink in the form of heat sink ring34 is configured to be coupled to base 5 a. Base 5 a, heat sink ring 34and heat sink 35 all form heat sinks configured to draw heat away fromLED plates 606 and 611 as well as to heat up the light. Heat pipes 33 aand 33 b are configured to be disposed inside of base 5 a. Heat pipes 33a and 33 b are configured as cylindrical tubes having a fluid disposedinside of them. When the heat at one end of the pipe reaches aparticular temperature, the fluid becomes a gas and is expanded to theopposite end of the pipe wherein the opposite end of the pipe is coupledto a heat sink as well. For example, a first end of heat pipes 33 a and33 b is coupled to heat sink 35. A second end of heat pipes 33 a and 33b is coupled to heat sink 34. Heat is transferred from heat sink 35 toheat sink 34 for the purpose of cooling heat sink 35 and thereby coolingLED plates 606 and 611 as well as their associated LEDs. The heat thatis transferred is also used to heat up the entire light 10 a includingbase 5 a, which can then be used to remove condensation/water/fluid aswell as ice which may impair the functioning of the light.

Heat pipes 33 a and 33 b extend in three different planes, particularlyfrom a front position on the light when coupled to heat sink 35, to aback position adjacent to base 5 a, and then back to the front positioncoupled to or adjacent to heat sink ring 34.

This design also includes rings 32 a and 32 b which are positionedadjacent to/coupled to heat pipes 33 a and 33 b. In addition, there isalso a gasket 31 which is coupled to base 5 a and positioned betweenbase 5 a and lens 9. This design also includes circuit board 1 as wellas a pole mount 3, and contacts 502 a and 502 b. In addition, there areshown a plurality of screws, nuts, and washers which are configured tocouple the different parts together.

FIG. 20A is a bottom view of the embodiment 10 a as shown in FIG. 19 .There is a plurality of cross-section lines A-A, B-B and C-C shown.Thus, FIG. 20B shows a first cross-sectional view taken along sectionA-A. In this view, lens 9 shows lens body 901, as well as an outer rim902. This view shows heat sink ring having a body section 3401 and areflector section 3406. Body section 3401 is coupled to flange section504 a of body or base 5. Heat pipes 33 a and 33 b are shown extendingfrom heat sink 35 to heat sink 34, particularly to heat sink body 3401.There is also another flange region 507 a which forms an opposite end ofbase or body 5. Coupled to flange region 507 a is circuit board 1. Inaddition, coupled to flange region 507 a is pole mount 3 as well ascontacts 502 a and 502 b.

FIG. 21A shows a cross-sectional view of the embodiment 10 a taken alongthe line B-B which shows a view that is rotated approximately 90 degreesfrom the section line A-A. In this view there is shown lens body 901having an outer rim 902. Outer rim 902 is coupled to body section 3401of heat sink ring 34. Body section 3401 is coupled to flange region 504a while reflectors 3406 are shown disposed adjacent to heat sink 35.Flange section 507 a is shown coupled to pole mount 3 which is coupledto contact 502 a. Disposed inside of the enclosure of the light formedfrom base or body 5 and lens 9 is heat sink 35 having lens plates 606and 611 coupled to it.

FIG. 21B shows another side cross-sectional view taken along line C-C.In this view there is shown lens body 901 which includes outer rim 902.Outer rim 902 is coupled to heat sink ring body 3401. Heat sink ringbody 3401 is coupled to flange region 504 a. In addition, extendingaround heat sink 35 is reflector 3406 which is configured to reflectlight from LEDs on LED plates 606 and 611. Disposed between flangesection 504 and flange region 507 a is body region 503 which includesfins 509 a. Coupled to flange region 507 a is pole mount 3 which iscoupled to contacts 502 a and 502 b.

FIG. 22A shows a bottom perspective view of the combination of thereflector and heat sink 34. This reflector/ heat sink combinationincludes a body section 3401, a reflector section 3406 as well as anopening 3402 and screw holes 3404. A bottom surface 3405 is configuredto be coupled to flange region 504 a.

FIG. 22B shows a front perspective view of the heat sink reflector whichincludes a reflective dome shaped surface 3406, an opening in the formof a rectangular opening 3402, a bottom flattened mounting portion 3403as well as holes 3404 for receiving screws for allowing a heat sink suchas heat sink 35 to be coupled thereto. This dome shaped reflector regionis substantially spherical which allows for a substantially uniformreflection of light out through lens 9.

FIG. 22C is a top view of the heat sink 36 which includes a reflector.This heat sink 36 is similar to heat sink 34 and can be used in place ofheat sink 34. There is a body section 3601, an opening 3602 and anotheropening 3607 wherein these openings are configured to receive associatedheat pipes such as ends 3305 (See FIGS. 26A, 26B and 26C). With theback-side view 22D there is shown hole 3604, as well as hole 3603. Hole3603 is configured for securing the heat sink 36 to the base 5 a. Hole3604 is configured for securing the heat sink 35 to the reflectorsection 3606. There is also a flange section 3605 which houses hole 3603wherein this flange section is for fitting over a flange region 504 awhich is at a front end of base 5 a. In addition, with the front-endview, there is shown bridge 3608 spanning between the two openings 3602and 3607. There are also shelves 3609 a and 3609 b which have screwholes, and which are also configured for securing the heat sink 36 tothe base 5 a.

FIGS. 23A, 23B and 23C are perspective cross-sectional views which showlens 9 having body 901 and edge section or outer rim 902. This lens edgesection or outer rim 902 is coupled to the heat sink ring 34 at body3401. Reflector 3406 is shown positioned adjacent to heat sink 35 whichhas LEDs coupled to it. A shown heat pipes 33 a and 33 b extend fromheat sink 35 to heat sink 34. Coupled to flange section 507 a ismotherboard 1. In addition, prongs or contacts 502 a and 502 b arecoupled to pole mount 3 which is coupled to base or body 5 a.

FIG. 24 shows a perspective view of LED plate 606 and or 6011 which hasLEDs 602 and 614 disposed on it respectively. LEDs 602 and 614 aremounted on a LED board 602 a and/or 614 a which is fastened to arespective LED plate 606 and/or 611. LED plate 606 and/or 611 draws heataway from their respective LED board.

FIGS. 25A, 25B, 25C and 25D show the different perspective views of heatsink 35. Heat sink 35 includes a body section 3501, openings 3503 and3504 which form channels to receive the associated heat pipes 33 a and33 b. There are also opposite openings 3508 and 3509 which feed intoopenings 3503 and 3504 respectively. These openings are curved to allowa curved or bending heat pipe to extend therein. A plurality of tabs3505 and 3510 extend laterally outside of the body 3501. Tab 3505includes holes 3506 and 3507 while tab 3510 includes hole 3513. Theseholes are configured to allow screws or fasteners to be placed thereinto fasten the heat sink to the other heat sink 34 wherein these screwsinsert into holes 3404 (see FIGS. 22A and 22B) FIG. 25D also shows aheater 3511 which is disposed in side of the heat sink body 3501,wherein as described above with respect to heater 625, this optionalseparate heater can be in the form of a resistor which is heated from afeed from the circuit board 1 which then heats up the heat sink 35 whichthen passes that heat through the associated heat pipes throughout thebody of the light which is bound by the base or body 5 a and lens 9 a.

FIGS. 26A and 26B show heat pipes 33 a and 33 b. Each of these heatpipes has a particular shape that extends in at least three planes. Forexample, there is a first body portion 3301 which is curved, this bodyportion extends to an end 3302. Body portion 3301 is configured to becoupled to and/or between body or base 5 a and ring heat sink 34. Bodyportion 3301 extends into a bend 3303 which allows the heat pipes 33 aand 33 b to extend from flange section 504 a to flange region 507 a.This extension in section 3304 which is also curved, then extends intoend section 3305 which then angles back into extending region 3305 whichextends into heat sink 35.

FIG. 27 shows the two heat pipes which show respective body portions3301 a, and 3301 b, ends 3302 a, and 3302 b, bends 3303 a and 3303 b,sections 3304 a and 3304 b, and end sections 3305 a and 3305 b.Accordingly, heat from heat sink 35 is generated and passed into end3305 or ends 3305 a and 3305 b which then causes fluid inside of heatpipes 33 a and 33 b to absorb this heat, as the heat is accumulated, theliquid changes state to a gas and is passed to the opposite end 3302such as ends 3302 a and 3302 b which are much cooler. Along the way theheat pipes are in contact with heat sink ring 34 as well as base 5 awhere this energy is passed into these heat sinks. Base 5 a serves as aheat sink as well.

FIG. 28 is a three-dimensional view of the embodiment 10 a which showsbase 5 a, motherboard or circuit board 1, lens 9, heat sink ring 34 aswell as heat sink 35 all separated from each other to provide for betterviewing of the components.

FIGS. 29A and 29B are views of the reflector/heat sink 40. Heat sink 40is configured for another embodiment which is for multiple heat pipessuch as four heat pipes. For example, heat sink 40 includes a bodysection 4001, a central opening 4002 a reflector section 4006 which issubstantially spherical, or dome shaped. There is also a back-flangesection 4003 which is configured to allow the heat sink 40 to be coupledto the base 5 a. A plurality of holes 4007 are in the flange section4003 for securing the heat sink to the base 5 a. The dome reflectorsection has a flattened region 4004 which has drill holes 4005 in it,these drill holes are for receiving the heat sink such as heat sink 41shown in FIGS. 30A and 30B.

FIGS. 30A and 30B show the heat sink 41 in a bottom perspective view anda top perspective view respectively. This heat sink 41 includes a bodysection 4101 and wings 4102 a and 4102 b. There are also mountingflanges 4105 and 4106 as well as channels 4103 and 4104 for receivingthe heat pipes. In addition, there is a central divider 4111 which isconfigured to divide these channels 4103 and 4104 apart from each other.Each of these mounting flanges 4105 and 4106 include respective holeswhich are configured to receive screws. As shown by FIG. 30B there is atop face 4110 which includes holes 4107, 4108, 4109 and 4110 which areconfigured to receive the respective heat pipes. FIG. 30B shows theembedded heater 4114 which can be selectively heated from an associatedcircuit board 1 wherein this heater much like heater 625 and heater 3511is an optional heater which can be made from a pure resistor or othertype of heating element so that the heat sink 41 can be selectivelyheated with electrical current passing from circuit board 1 and intoheat sink 41.

FIGS. 31A and 31B show bottom perspective view and a top perspectiveview respectively of the heat sink plate for housing the different LEDboards. For example, there is a five faced heat sink plate device whichincludes a first top face 4201, a second face 4202, a third face 4203, afourth face 4204, and a fifth face 4205. On each of these faces areassociated LED circuit boards having respective LED lights. For example,there is a first LED light board 4206 on the first face 4201, a secondLED light board 4207 on the second face 4202, a third LED light board4208 on face 4203, a fourth LED light board 4209 on face 4204, and afifth LED light board 4210 on face 4205. Essentially this heat sinkplate has five sides similar to a six-sided cube with one face missing.

FIG. 32 shows a perspective view of the different heat pipes whichinclude heat pipes 4301, 4302, 4303, and 4304. Each of these heat pipesincludes a plurality of different sections such as a body section 4301a, a first end section 4301 b, a bend section 4301 c, a lower bodysection 4301 d, another bend section 4301 e and second end 4301 f. Heatfrom the heat sink 41, is conducted to the heat pipe 43 such that itenters end 4301 f and then causes a fluid inside of the heat pipe toturn into a gas and then expand and extend from this end 4301 f toopposite distal end 4301 b. End 4301 f is disposed inside of heat sink41. The bend section 4301 e causes the heat pipe to extend in anotherplane, across and behind the reflector region 4006 such that the heatpipe extends into region of body section 4301 d and up to another bendregion 4301 c and across body region 4301 a, and into opposite end 4301b which is disposed between heat sink 40 and base 5 a. Thus, with four(4) different heat pipes more heat is dissipated from heat sink 41 andon to heat sink 40 and base 5 a which is essentially a heat sink aswell. the heat extends throughout the body of this light and thereforeis configured to heat the light throughout the entire body of the lightso as to remove moisture as well as to melt an outer shell or lens 9 onthe light.

FIG. 33A is a bottom perspective view of the lens 44. Lens 44 includes amain lens body section 4401, a rim section 4402, a cone region 4403, andan open end 4404 which is configured to receive the light emanating fromLED light board 4206 of the associated LED light (See FIG. 31B). Lens 44also includes a substantially dome shaped region 4407 which is elevatedabove cone 4403 as well.

As shown above, the headlights can be made from multiple differentdesigns. For example, FIG. 34A is a perspective view of a first set ofcontacts 3000 which includes a block 3001, and a plurality of contacts3002, 3003, and 3004. Thus, this is a three-prong block of contacts foruse with any of the above or below headlamps. With a three-prong outlet,there can be three different contacts such as 3002, 3003, and 3004 whichcan be any one of phase, neutral and/or ground. FIG. 34B shows thatthere is a two-prong set of contacts, contact block or pole block 3 asshown above. As described above this contact block can be used with anyof the above different headlights or below different headlights as well.

FIG. 35A is a side view of a first body 3012 for the light 3010 which iscoupled to a front heat sink 3011 and wherein this first body 3012 hasfew fins and a smooth side body. Alternatively, FIG. 35B is a side viewof a second body 503 for the light wherein this second body 503 has sidefins 503 a as well to facilitate heat transfer to the outside air.

FIG. 36A is a perspective view of a first flow pattern for a heat pipewhich shows heat pipes 33 a and 33 b which allow for a transfer of heatfrom a back circuit board to a front of the light. FIG. 36B also showsthis feature.

FIG. 37A is a perspective view of a first set of heat pipes 401, and 402while FIG. 37B is a perspective view of a second set of heat pipes 33 a,33 b while FIG. 37C is a perspective view of a third set of heat pipes4301.

FIG. 38A is a front perspective view of the reflective pattern of areflector 34, while FIG. 38B is a front perspective view of a reflectionpattern of another set of reflectors 11, 12. FIG. 39A and 39B is a viewof a heat sink 701 which can be used with reflectors 11 and 12 of FIG.38A.

FIGS. 40A and 40B a front perspective view of a back heat sink and aside view of the heat sink 40.

FIG. 41A is a perspective view of a LED mount having LED's 606, and 811;FIG. 41B is a perspective view of another LED mount 49 which has LED's49 a, 49 b and 49 c. FIG. 41C is a view of an LED array including LED's42 a, 42 b, 42 c, 42 d and 42 e making this LED array 42 a 5 LED arraysystem.

FIG. 42A is a front-side perspective view of a heat sink 35, while FIG.42B is a back-side perspective view of this heat sink 35. An alternativeheat sink can be used, wherein heat sink 41 is shown in FIG. 42C is afront-side perspective view while FIG. 42D is a back-side perspectiveview of the second heat sink 41.

FIG. 43A is a side view of a lens 950 while; FIG. 43B is another sideview of the lens 950 of FIG. 43A. This lens can have nanoparticlesinterspersed within this lens. This lens can be used in place of any ofthe other above shown lenses with any of the above or below embodiments.FIG. 43C is a side view of a lens 9, while FIG. 43D is another side viewof the lens 9 which can be used in place of any of the above lenses aswell. FIG. 44A is a side cross-sectional view of a lens; FIG. 44B is aside view of the lens 44 of FIG. 44B; FIG. 44C is a front view ofanother lens 960 which has different lenses 961, and 962 which aredifferent angled lenses; FIG. 44D is a side view of the lens 960. FIG.44E is a front view of another lens 4519 which includes different angledlenses 4519 a and 4519 b. FIG. 44F is a side perspective view of lens4519;

FIG. 45 is a front view of another headlight 4500 which has a front heatsink 4501 and a lens 4502. FIG. 46 is a perspective view of theheadlight of FIG. 45 , which allows for a front heat sink 4501 and areflector 4503, and a heat sink 4504 which has LEDs.

FIG. 47 is a side view of the headlight of FIG. 45 . While FIG. 48 is aside perspective view of this headlight 4500. These views show frontheat sink 4501 which has heat pipes coupled to it 4505 and 4506 whichare also coupled to heat sink 4504 as well. These heat pipes 4505 and4506 are therefore configured to connect heat sink 4501 and heat sink4504. Contact block 3001 includes three different contacts 3002, 3003,and 3004 as well which are configured to feed power to a circuit board3006.

FIG. 49A is a block diagram of an electrical system for a 5000 headlightwhich include the light's energy flow. This block diagram is configuredto take power in, turn on the light, and enable it to perform itsprimary function, and all subsequent sub functions. For example, thiselectrical system includes an input power 5001 in the form of contactsin a contact block such as block 3001 comprising contacts 3002, 3003,and 3004 or contact or pole block or pole mount 3, comprising contacts52 a and 52 b. This input power 5001, provides power to a motherboard5002 such as motherboard or processor 101, or 3006. On this motherboard5002 is a line filter 5003, an input monitor 5004, a thermal monitoringand thermal protection circuit and an LED driver 5005. The LED drivertakes the power from the input power, regulates it and then sends it onto the LED such as LED 5006. This LED can be any one of the LED's shownabove such as LEDS 49 a, 49 b, 49 c, or LED's 42 a, 42 b, 42 c, 42 d or42 e, or LED's 4206, 4207, 4208, 4209, or 4210 or LED's 602, 614, 602 a,or 614 a. These LEDs such as LED 5006 then generates light in the formof radiated energy 5007, and heat in the form of conducted energy 5008to an associated tombstone heat sink FIG. 42 a , 42B, 42C, and 42D.These heat sinks 42 a thru 42D then transfer heat via the associatedheat pipes such as through heat pipes 401, 402, 33 a, 33 b, or 4301 (SeeFIGS. 37A, 37B, or 37C). The heat pipes then transfer the heat to theassociated ring heat sink such as ring c heatsinks 701 or 40 shown inFIGS. 39A, 39B, 40A and 40B. The radiated light is then sent to the lens5009 such as any one of lenses 44, 960, or 4519 such as shown in FIGS.44A, 44B, 44C, 44D, 44E, or 44F.

FIG. 49B is a block diagram of an electrical system for a headlightwhich includes all of the components listed in FIG. 49A, but it alsoincludes a heater 5011A used as a heat generator 5011B such as aresistor and/or coil which takes power from input power 5001 andtranslates this power into heat. Additionally, driver board 5002,transfers its heat losses 5008B via heatpipes FIGS. 37A, 37B, and FIG.37C.

FIG. 50 is another block diagram for the electrical system for theheadlight which includes the light's energy flow. This block includesall of the elements shown in FIG. 49A but it also includes an additionalLED driver 5012 which is configured to drive a separate LED such as LED5014 disposed on motherboard 5002, which as described above transferslight in the form of light radiated energy 5015 and heat in the form ofheat conducted energy 5016 to the remaining components such as the lens5009 and the associated ring heatsink 5010 in the manner describedabove. LED 5014 is similar to LED 5006 in which it represents the abovelisted LED's such as LEDS 49 a, 49 b, 49 c, or LED's 42 a, 42 b, 42 c,42 d or 42 e, or LED's 4206, 4207, 4208, 4209, or 4210 or LED's 602,614, 602 a, or 614 a. Additionally, driver board 5002, transfers itsheat losses 5008B via heatpipes FIGS. 37A, 37B, and FIG. 37C. FIG. 51 isanother block diagram for the electrical system for the headlight whichincludes the components shown in both FIG. 50 as well as the additionalcomponents shown in FIG. 49B which include an additional heater 5011with thermostat 5011A which transfers conducted energy 5011B.

FIG. 52 is another block diagram for the electrical system for theheadlight, which also includes all of the components listed above inFIG. 51 , but it also includes a separate temperature sensor and ade-icing system 5019 which can be used to activate the power output frominput power 5001, and pass this heater 5011A and generates conductedheat energy 5016B

FIG. 53 is another block diagram for the electrical system for theheadlight which includes the heat flow diagram and the components listedin FIG. 52 however, in this design, the temperature sensor is notdisposed on the motherboard but off of the motherboard 5002 such thatthis temperature sensor is a temperature sensor 5020 disposed on adifferent region such as on a heat sink or housing of the headlight. Thede-icing controller 5021 can also be disposed separate from themotherboard 5002.

Another embodiment can include FIG. 54 shows a schematic block diagramof the circuit board 1. The entire light, either light 10 or 10 a isconfigured to be controlled by circuit board 1. Circuit board 1 includesat least one processor 101, at least one temperature sensor 103, atleast one solid state relay 104, configured to activate the light or LEDthrough a feed to the light 108 . . . There is at least one power supply105 which is in contact with contacts 502 a and 502 b. There is also anI/O port 107 which is configured to receive instructions from a controlpanel or the solid-state relay wherein a user then switches on the lightor sends instructions to the motherboard 109. Motherboard 109 isconfigured to allow the above components to communicate with each otherand to be powered by the power supply 105.

FIG. 55 shows a feed to the heater 110 wherein this feed is a separatefeed depending on the transistor or switch 104 a. solid state relay 104a is configured different from transistor or switch 104 in that switch104 it selectively turns on or off as instructed by processor 101.However, switch 104 a selectively turns on or off either or both thefeed to the light 108 as well as the feed to heater 110. Thus, processor101 can selectively activate LED lights such as lights on boards 4206,4207, 4208, 4209 and 4210 or lights 602, 614 (See FIG. 24 ) or lights602, 614 (See FIGS. 13A and 13B.) This embodiment also includes aninside input 103 a and an outside input or sensors 103 b which feed intothe temperature sensor 103, so that the temperature sensor 103 candetermine both the temperature inside of the light body (formed by Lens9 and body 5 or 5 a) or outside of the light body.

FIG. 56 shows a flow chart for method of operation of the headlight andone process for controlling the heater during extreme weatherconditions. For example, in extreme cold weather environments, a lightcan have moisture build up even frost and/or snow or ice buildup on theoutside of the body of the light. Therefore, so that the light can befree of water obstructions and be clear and visible, the system such asprocessor 101 can be configured to in Step 1, when input power 5001 isfed into the light, the LEDs will turn “ON”, the vehicle operator willselect a high beam or low beam setting. The vehicle operator will alsobe able to dimming the light as necessary. Next Step 2, the temperaturesensor 103 will send a signal to the processor 101 indicating thetemperature inside and outside of the light. If the temperature is abovezero degrees, the processor 101 will maintain the LEDs working normally.If the temperature sensor indicates that temperature is below zero, theprocessor 101 will turn on the heater 5016A. Step 3, when thetemperature in the ring heatsink 701 is above zero degrees, theprocessor 101 turn “OFF” heater 5016A.

FIG. 57 discloses a new embodiment which shows a base 5140 at one endand a lens 5111 at another end. Disposed between the base 5140 and lens5111 there is a heat sink tombstone 5101 disposed under the lens whichis configured to house LED lights. This heat sink tombstone 5101 isdisposed in a reflective bowl. The bowl 5117 is disposed inside of base5140. Disposed around the reflective bowl is a heat sink ring 5108. Apin 5116 and a screw 5118 are configured to set the tombstone heat sink5101 in place. There is also a round heater 5106 which is configured toset within the ring heatsink 5108. This round heater 5106 is in contactthe ring heatsink and when power is applied generatesheat, therefore,increasing the temperature heatsink ring 5108. Heat pipes 5107 areconfigured to transfer heat from the LED lights in the tombstone to theheat sink ring 5108. These heat pipes 5107 are configured to transferheat via a heated fluid from one end to another end along the pipe asdisclosed above with the other disclosed heat pipes. Disposed adjacentto these heat pipes 5107 is a gasket 5113.

A plate 5110 is also configured to transfer heat away from themotherboard 5102 and through heat transfer gap pad film 5114 them thruthe heatpipes 5107 and finally to ring heatsink 5108. In additioncoupled to the tombstone is a motherboard 5102 which has electroniccomponents configured to control the lighting of the LED lights, as wellas for the selective energizing of heater ring 5106. The motherboard issecured to the base 5110 via screw 5103, washer 5132 and nut 5130. Inaddition, there is also an insulating washer 5115 and an angled contact5121 which are configured to secure the the power connection with prongs5126 and insulating plate 5104 to the base 5140. At least one screw 5109is also configured to secure the base 5140 with the heat ring 5108 aswell. In addition a plurality of screws and washers are also configuredto secure the base to the heat sink ring 5108. There is a bolt 5119, aspacer 5125, a washer 5131, another lock washer 5133 as well as bolt5122 which is configured to insert through spacer 5125, washer 5131, andwasher 5133 used for the purposes setting the light's properorientation. There is also a back insulation plate 5104 which isconfigured to be secured to base 5140. Back insulation plate 5104 hascontact prongs 5126 and is secured to base 5140 via at least one rivet5112.

FIG. 58A is a side exploded view of a head lamp 5100 which includes abase 5140 having prongs 5126 and a lens 5111. Infused in lens 5111 aremetallic nanoparticles which are configured to capture radiated heatfrom the LEDs, heating the lens and and then transfer such heat to thethe sink ring 5108 to the glass of the lens 5111. Because there arenanoparticles that are heat conducting in the lens, heat is transferredto the front of the lens and then to the heat sink ring.

In addition FIG. 58B shows a side view of a head light 5100 whichincludes a lens 5111 and a base 5140. FIG. 58C shows a perspective viewof a headlight 5100 with a lens 5111 and a base 5140, which is coupledto a heat sink ring 5108.

FIG. 59 shows a bottom view of the embodiment 5100 which show acrosssectional lines A-A, B-B, C-C, D-D.

FIG. 60A shows a cross-sectional view through section line A-A whichshows lens 5111 and which is coupled to the heat sink ring 5108. Asshown the reflective bowl 5117 is set inside of the base 5140 and iscoupled to the heat sink ring 5108. Disposed in the middle andsurrounded by the reflective bowl 5117 is the tombstone 5101 which isconfigured to hold the LED lights. There is also shown a heat pipe 5107which extends down from one end connected to heat sink ring 5108 and atthe other end to the tombstone 5101. The heat sink ring 5108 includes abowl portion 5108 a as well wherein the reflective bowl 5117 sitstherein. There is also shown contact prongs 5126 which extend down fromthe base 5140.

FIG. 60B shows a side cross-sectional view along the lines B-B whichshows lens 5111 set on heat sink ring 5108 which sits on base 5140.There is tombstone 5101 which sits on plates 5110, 5114 and motherboard5102. In addition coupled to base 5140 are contact prongs 5126 whichallow the headlight to plug into power.

FIG. 60C shows a side view of headlight 5100. This side view shows lens5111, reflector bowl 5117, tombstone 5101, contact prongs 5126, base5140 and heat sink ring 5108, wherein heat sink ring 5108 is coupled tobowl 5140 and tombstone 5101 is coupled to heat sink bowl 5108, whilereflector bowl 5117 is coupled to heat sink ring 5108.

FIG. 61A shows detail F which shows a close up view which is aconnection between heat sink ring 5108 and base 5140. There is alsoshown heater ring 5106, heat pipe 5107, and gasket 5113 positionedbetween ring 5108 and bowl 5140. FIG. 61B shows Detail E which showsheat sink ring 5108 coupled to base 5140 with heat pipe 5107 gasket 5113positioned between heat sink ring 5108 and base 5140.

FIG. 62 shows a side view of the light 5100 which includes base 5140which is coupled to lens 5111 via heat sink ring 5108. There is showntombstone 5101 which is coupled to base 5140 via ring heat sink 5108.There is also shown motherboard 5102 which is in communication withcontact prongs 5126 such that prongs 5126 feed power to motherboard 5102which then feeds power onto tombstone 5101. Thus, the heat generated bythe LED light is absorbed by the tombstone, passed to the heat pipes5107 and then on to the heat sink 5108 as well as on to the the base5140.

FIG. 63 shows an exploded view of the headlight which shows reflectivebowl 5117 which sits inside of heat sink ring 5108. The heat sink ring5108 sits in base 5140. Tombstone 5101 which is coupled to associatedwith heat pipe 5107. There is also shown the heater ring 5106 which isdisposed adjacent to the gasket 5113. gasket 5113 is configured to sitin side of a slot 5141 in base 5140. Different plates including boardmount plate 5110, intermediate electrical insulation plate 5114 andmotherboard 5102 are stacked together but still separated by screws andwasher 5103, 5132, and 5130. There is also a set of contact prongs 5126coupled to base 5140 and configured to feed power to base motherboard5102. There is a 5102.1 pointing to screw 5103 but not described.

FIG. 64 shows a cut away view of a portion of the light which includesheat ring 5108. Heat pipe 5107 is shown coupled to heat ring 5108. Thereis also shown motherboard 5102 which is coupled to the heat ring 5108.There is also shown tombstone 5101 as well as LED light 5101.10 as well.There is also shown reflective bowl 5117.

FIG. 65A shows an exploded view of the tombstone 5101 which includes atombstone base 5101.2 which is secured to adjacent objects via a pin5101.3 and screw 5101.5 which passes through countersink hole 5101.8.There is also a U-shaped plate 5101.1 which includes LED 5101.10.Disposed below plate 5101.1 is tombstone base 5101.2 which has holes5101.25 and 5101.26. There is a top hood 5101.4 which has wings 5101.4 aand 5101.4 b which extend out over LED lights 5101.10. Hood 5101.4 issecured by screw 5101.7.

FIG. 65B is a perspective view of tombstone 5101 which includes screw5101.7 hood section 5101.4, wings 5101.4 a and 5101.4 b. Tombstone 5101has base 5101.2 which includes wings 5101.21 and 5101.22. Each of thesewings are configured to receive heat pipes which extend down throughholes 5101.25 and 5101.26. There is also a block 5101.9 which isconfigured to secure the tombstone 5101 to the adjacent components.

FIG. 66A shows a side view of the tombstone 5101 which includes atombstone base 5101.2. There is shown LED lights 5101.10 which arecoupled to tombstone base 5101.2. Hood 5101.4 includes wings 5101.4 aand 5101.4 b. These wings reflect the light back from the LED lightssuch as lights 5101.10 so that the light is reflected back to thereflective bowl 5117. There is shown screws 5101.6 b and 5101.6 a whichare configured to couple the LED to the tombstone 5101.2. Additionalblocks 5101.9 and 5101.9 a are shown extending out from tombstone block5101.2. These blocks 5101.9 and 5101.9 a are configured to lock thetombstone to an adjacent block such as to heat sink ring 5108.

FIGS. 66B, 66C and 66D show the different components of the tombstone,which shows the two different wings 5101.21 and 5101.22. There is alsoshown hood 5101.4 having wings or leafs 5101.4 a and 5101.4 b whereinthe hood is secured by screw 5101.7. Light such as LED light 5101.10 isshown coupled to tombstone block 5101.2 via screw 5101.6 a. Additionalside blocks 5101.9 and 5101.8 extend out from the side of the tombstoneand allow the tombstone 5101 to be secured to adjacent components suchas to the heat sink ring.

FIG. 67 shows a perspective view of another embodiment 6000 which showsa lens 6010 which is configured to be coupled to heat sink ring 6009.Disposed inside of the housing of the headlight is a reflector unitcomprising dual reflector units 6015 and 6016 which sit inside of thebase 6006. There is also a reflector or hood 6014 and a lens 6011 whichreflect and diffuse light from a LED circuit board 6008 which is coupledto a tombstone heat sink 6008. There are also heat pipes 6005 which aredisposed at least partially inside of the tombstone heat sink 6008wherein this heat sink and heat pipes are configured to draw heat awayfrom the LED circuit board 6002. When a LED circuit board heats up it isimportant to draw the heat away from this circuit board in order toavoid thermal meltdown. The lens 6011 is is a block lens that has atriangular cross section and sits underneath a hood 6014 which focusesthe reflected light back onto the reflectors or reflector units 6015 and6016.

There is also a heat sink plate 6007 which draws heat from themotherboard 6001 from intermediate dielectric insulation thermal gap padfilm 6013 through heat plate 6007 and onto the heat pipes 6005. There isalso a gasket 6012 which is configured to sit inside of base 6006 andwhich is configured to receive and seal the heat sink ring 6009 to thebase 6006. The base 6006 is also configured to conduct heat as well.Thus, the heat from motherboard 6001, as well as heat from the LEDlights such as from the LED light board 6008, is then transferredthrough the heat pipes 6005 to the heat sink ring 6009, to the lens 6010which has conductive nanoparticles such as steel or other metallicnanoparticles a well as pass heat onto the base 6006 thereby heating upthe entire headlight 6000 which would then result in the defrosting ofthe headlight as well as facilitate the removal of or entirely removethe ice, snow and frost from the headlight.

FIG. 68A is a side cross-sectional view of the light 6000 which includesa lens 6010 a heat sink ring 6009 shown coupled to base 6006. Reflectors6016 and 6015 are also shown as well as lenses 6011, backlightreflectors 6014 are positioned above these lenses 6011. A cluster ofLEDs 6080 is shown positioned below lens 6011 wherein the light from theLED light shines through the lens 6011 into reflector 6014 and then isbounced back towards the reflectors 6015 and 6016. This light is thenprojected as reflected light though lens 6010 and out from theheadlight.

FIG. 68B shows a side view through detail G shown in FIG. 68A, whereinthis view shows a side rotated view of the lens 6011 positioned adjacentto a LED light 6080 and covered by backlight reflector 6014.

FIG. 69 is a side view of a portion of the headlight which shows circuitboard 6001 which contains a microprocessor configured to turn on or offthe LED light 6080, as well as LED light plate 6008, and an individualLED light 6080 is shown. Reflector or lens 6011 is also shown positionedadjacent to LED light wherein this reflector is covered by reflectivehood 6014. Heatpipe 6005 is configured in a circular pattern touniformly distribute the heat about heatsink ring 5108.

FIG. 70 is an upside down view which shows a side exploded perspectiveview of the embodiment 6000 which shows lens 6010, tombstone heat sink6002, a different hood reflector 6014 formed as a one piece hood, aswell as heat sink ring 6009. There is also shown prongs 6026 which areconfigured to plug into a power source and which provide power to themotherboard 6001.

FIG. 71 is a rotated view which is is a side cut-away view which showsmotherboard 6001, a reflector 6016, heat sink ring 6009, heat pipe 6005showing its conveyance of heat away from the LED 6008, onto thetombstone heat sink 6002, through the heatpipes 6005 and towards theouter periphery as well as to the heat sink ring 6009.

FIGS. 72A and 72B shows the tombstone frontal mount heatsink ringconfiguration. FIGS. 73A and 73B shows the tombstone rear mountconfiguration for both lighting tombstone elements 6025 or 6026 of theheadlight. For example there is shown in FIGS. 72A and 72B an explodedview and an assembled view respectively of a tombstone heat sink 6002,an LED board 6008, LED lights 6080, lens 6011 as well as reflector 6014.The reflector 6014 is a double plate or two plate reflector formed in asubstantially V-shape. This design allows for a closer distance betweenthe LEDs and the heatsink ring, however, two reflectors are needed.

With the embodiment shown in FIGS. 73A and 73B there is shown asubstantially U-shaped reflector plate 6021, a substantially U-shapedLED motherboard 6082 which wraps around tombstone heat sink 6022. Withthis design, the heat pipes reach all the way up to the LED motherboard608 a to draw heat away from the LED motherboard from the rear of theheadlight. This design allows for the use of a unique single bowlreflector 5117. This LED motherboard includes a conductive backing todraw heat away from the LED lights 6083.

Thus, there is shown a headlight which is powered by a LED light whereinthe heat from the LED light is transferred to the adjacent heat pipe5107 which then transferred heat to the adjacent heat sink ring tode-ice the headlight.

Because this heat is transferred to the heat sink ring 5108 it is thentransferred onto the lens 5111, the heat sink ring 5108 and the lens arede-iced and kept clear or ice.

Alternatively, if additional heat is needed or if it is not necessary touse the LED lights, a heater ring 5106 is configured to be electricallycoupled to motherboard 5102 such that motherboard 5102 sends power ontoheater ring 5106 to further increase the temperature of the heat sinkring 5108 which then passes heat onto the lens 5111 to melt any amountof ice build up in front the headlight.

Each and every one of the components of each and every one of theembodiments is interchangeable with the other components of the otherembodiments. For example, each of the heat pipes is interchangeable withthe heat pipes of the other embodiments, each of the lenses isinterchangeable with the lenses of the other embodiments, each of themotherboards is interchangeable with the motherboards of the otherembodiments, and each of the tombstone heat sinks is interchangeablewith the tombstone heatsinks of the other embodiments. Each and everyone of the LED or LED boards is interchangeable with the otherembodiments. Each and every one of the heat sink rings isinterchangeable with the other heat sink rings. Each and every one ofthe reflectors is interchangeable with the other reflectors of the otherembodiments.

Thus, there is shown that all the heat generated by each heat source,can be transferred forward to the front via heat pipes 33 a or 33 b thenusing the ring heatsink 34 to dissipate such heat onto the environment.

FIG. 74A shows another embodiment 7000 of the invention which shows abase or body 7004 having prongs 7001 extending out from a back region ofthe base 7004. Base 7004 can have fins such as fin 7014. There is areflector 7006 which is positioned within the base 7004. There is aheatsink ring 7018 which is coupled to the base 7004 and which has a rim7021. A lens 7009 has a rim 7008 and is coupled to the heatsink ring7018 opposite the base 7004. A dual driver board 7011 is coupled to base7004. There is a heatsink 7010 which is tombstone shaped (but which canbe of any shape) coupled to the dual driver board 7011. Heatsink 7010 isconfigured to draw heat away from the dual driver board 7011. On eitherside of the heatsink are LED boards 7020.1 and 7020.2. Two LED arraysare on each of the LED boards, 7020.1 and 7020.2 respectively.

Each LED board, 7020.1 and 7020.2 contains two identical LED arrays,7024.1 and 7024.2. Two screws 7025 fasten the LED boards, 7020.1 and7020.2, onto the tombstone heatsink, 7010. In addition, two connectors,7022, is positioned on LED boards, 7020.1 and 7020.2, and are configuredto connect the LED boards coming from the dual driver board, 7022, whichfeeds power the LED arrays, 7024.1 and 7024.2, positioned on each LEDBoard,. This dual driver board, 7011 is configured as a driving deviceto power the LED light arrays such as lights 7024.1, 7024.2.

There is also shown reflectors 7012 and 7013 which are used to reflectthe light from the LED light arrays 7024.1 and 7024.2. The centerportion of the reflectors redirects the LED light from array 7024.1 ontothe center focal point 7026.

FIG. 74B is a similar view to that of FIG. 74A wherein in FIG. 74B thelight that is reflected is from outer LED light arrays 7024.2. This isbecause only the outer lights of each of the arrays are used as shown ingreater detail in FIG. 75 . Thus in FIG. 74A the inner lights are set toshine to a focal point 7026. In FIG. 74B the outer lights are set toshine to two different focal points 7027 and 7028, using the reflectivesurface which to the right and left of the center portion of thereflector.

FIG. 75 shows the wiring embodiment 7050 of LED boards 7020.1 and LEDBoard 7020.2 which are fastened onto tombstone heatsink 7010. LED boards7020.1 and LED board 7020.2 are energized by separate drivers 8002 and8003. Drivers 8002 and 8003 are coupled to connectors 7022.1 and 7023.1drive LED array 7024.1. Drivers 8002 and 8003 are coupled to connectors7022.1 and 7022.2 to drive LED array 2074.2. Connector 7022.1 isconfigured to connect to the inner LEDs 7024.1 c, 7024.1 d, and 7024.1e. Connector 7023.1 is configured to connect to LEDS 7024.1 a and 7024.1b. Similarly connector 7022.2 is configured to connect to LEDs 7024.2 c,7024.2 d, and 7024.2 d. Connector 7023.2 is configured to connect toLEDs 7024.2 a, and 7024.2 b

As stated above connector 7022.1 is configured to connect to LEDS 7024.1a and 7024.1 b on LED board 7023,1, and LEDs 7024.2 a and 7024.2 b whichare the outer LED's on LED board 7023.2. Connectors 7022.1 and 7023.1are connected via lines 8007 and 8008 which are driven by driver 8002fed through circuit 8005. Driver 8003 is configured to drive circuit8006 which is connected to lines 8009 and 8010. Lines 8013 and 8014 feedinto circuit 7022.2 while lines 8011 and 8012 feed into circuit 7023.2.Connector 7022.2 connects to LED's 7024.2 a and 7024.2 b while circuit7023.2 drives LED's 7024.2 c, 7024.2 d, and 7024.2 e. Thus, with thisdesign, the different LED's can be fed by different lines and used torun the light such that the light either has a singular central focalpoint 7027 shown in FIG. 74A or a double focal point such as focalpoints 7027 and 7028 shown in FIG. 74B for a more widely dispersedlighting effect. Thus, the outer LEDs when lit such as LEDs 7024.1 a and70241.b and 7024.2 a and 7024.2 b create a dual focal point light shownin FIG. 74B while the inner LEDs of 7024.1 c, 7024.1 d, and 7024.1 e or7024.2 c, 7024.2 d, and 7024.2 e when lit create a singular focal point.In addition, because the central LEDs can be driven separately from theouter LEDs the center LEDs can be made brighter or dimmer relative tothe outer LEDs.

FIG. 76 is a view of the three dimensional model shown in FIGS. 74A and74B. This view shows heatsink 7010 with heatpipes 7030, 7032. On LEDBoard 7020.1 there are LED's 7024 as well as connector 7022. There aretwo screws 7025.1 and 7025.2. A cross-member or rim 7021, bridges orsupports front annular heatsink 7018.

FIG. 77 is another view of another embodiment which includes a pluralityof heatpipes 7030 and 7032 which feed through tombstone heatsink 7010.There is a dual driver board 7011 which is coupled to tombstone heatsink7010. In addition, there is a LED board 7020.1 which is coupled totombstone heatsink 7010. Heatpipes 7030 and 7032 are fed throughchannels 7033.1 and 7033.2 in tombstone heatsink 7010. Coupled totombstone heatsink 7010 and to LED board 7020.1 are synthetic jetsincluding synthetic jet or synthetic jet 7040 and synthetic jet 7042.These synthetic jets drive the cooling material through the heatpipes7030 and 7032 to move heat from the back of the headlight to a forwardposition on the headlight.

Similarly, FIG. 78 shows another view of this embodiment which showsheatsink 7010 with channels 7033.1 and 7033.2 for receiving theheatpipes 7030 and 7032. Each of these heatpipes 7030 and 7032 haverespective couplings such as coupling 7029 for heatpipe 7030 while acoupling 7033 is for heatpipe 7032. This view shows synthetic jet 7040coupled to heatpipe 7030 adjacent to heatsink 7010 while synthetic jet7042 is coupled to heatsink 7010 as well as to heatpipe 7032.

FIG. 79 shows another view of the pipe-heatsink configuration whereinheatpipes 7030 and 7032 are coupled to a tombstone heatsink 7010.Tombstone Heatsink 7010 includes sections 7010.2, 7010.3 which isconfigured to connect to LED boards, 7010.4 which is a base, and abottom having screw holes 7010.5 for connecting to a light blocker plateused to block the forward light back to the reflector so that the lightcan be focused on the three focal points. There is also shown couplings7029 and 7034 for the heatpipes as well.

FIG. 80 shows a bottom perspective view of the driver board 7011 as wellas LED board 7020 which are coupled together via heatsink 7010. Heatpipe7030 has check valve 7029 while heatpipe 7032 has another check valve7034. Heatpipe 7030 is extending through channel 7033.1 while heatpipe7032 extends through channel 7033.2. There is shown an array of LED's7024.1. In addition, there is shown synthetic jets 7040 and 7042 whichare used to drive the cooling material through the heatpipes 7030 and7032 respectively. When the light is activated, synthetic jets begin tooscillate and causing fluid motion through the heatpipes. The movingfluid picks up the heat generated by the LED and driver boards attachedto the tombstone heatsink 7010. With the aid of the synthetic jets,heatpipes then carry the heated fluid onto the front heatsink where theheat is dissipated on the environment.

FIG. 81 shows the fluid reservoir inside the heatpipe system includingheatpipes 7030 and 7032. For a fluid system to work, there has to be areservoir of fluid within the system that will enable the heatpipepiping system to always remain primed, the darker shaded regions of theheatpipes are the sections with the fluid. The system also has two checkvalves or couplings 7029 and 7034 that restricts the fluid to flow inonly one direction. The fluid system allows the synthetic jets fluid tofreely move fluid from the hot side of the system such as adjacent tothe tombstone heatsink 7010 having end 7010.4 and screw holes 7010.5 tothe cold side of the system, away from the heatsink 7010 eventuallyallowing the fluid to deposit the heat in the front heatsink's fins, andfrom heatsink fins, moving the heat onto the environment using naturalconvection. There are also shown two synthetic jets 7040 and 7042 aswell coupled to the heatsink 7010 and which is configured to drive fluidthrough the heatpipes.

FIG. 82 , shows an embodiment of a synthetic jet which is an actuatorthat move fluid by oscillating a membrane with piezo device to ingest afluid into and expulse a fluid out of a cavity across an orifice. Thissynthetic jet 7040 includes a first section 7040.1 and a second section7040.2 wherein these two sections are coupled together. An input port7040.3 is configured to allow fluid to flow therein, and an output port7040.4 is configured to allow fluid to flow out from the synthetic jet.

FIG. 83 , shows an embodiment of a synthetic jet positioned under thedriver board 7011. This position allow for a much larger synthetic jetable to displace a large volume of fluid. There is a cabinet 7060coupled to the board 7011. Cabinet 7060 is configured to house syntheticjets (not shown in this diagram). Coupled to the cabinet 7060 isheatsink 7010 as well. Heatpipes 7030 and 7032 have one way valves orcouplers or check valves 7029 and 7034 respectively. A section 7030.1 ofheatpipe 7030 has fluid in it, while another section 7032.1 of heatpipe7032 has fluid in it as well.

FIG. 84 shows a 180 degree view of FIG. 83 , which shows the syntheticjet in relation to the LED boards 7020. In this view LED array 7024 isshown, while heatpipes 7030 and 7032 are shown feeding into heatsink7010. These heatpipes also feed into cabinet 7060 as well. Heat is drawnfrom circuit board 7011 and 7020 to heatsink 7010 and cabinet 7060(having synthetic jets not shown) and then transferred to heatpipes 7030and 7032 so that the heat is transferred from a back of the headlight toa forward position of the headlight thereby heating up the body of theheadlight as well as the lens of the headlight and also drawing heataway from the respective circuit boards 7011 and 7020 as well.

FIG. 85A is a bottom view of a dual synthetic jet shown in FIGS. 83 and84 . For example, the dual synthetic jet 8020 includes a body or housingsection 8022 which has a plurality of ports such as port 8024, 8026,8028, and 8029. Heatpipe 7032 is coupled to port 8026 at a first end andto port 8029 at a second end. Heatpipe 7030 is coupled to port 8024 at afirst end and to port 8028 at a second end (see FIG. 84 for reference).

FIG. 85B shows the upper view of the dual synthetic jet in an explodedview which shows a synthetic jet #1 top cover 8030 being removed fromhousing 8022 to expose a bladder 8032 inside of a bladder housingsection 8036. Bladder housing 8022 has openings or ports 8024 and 8028.On the opposite side synthetic jet #2 8034 shown adjacent to syntheticjet #1 8030 and which is on the far side of divider wall 8031.

FIG. 85C is a transparent view of the dual synthetic jet 8020 whichshows housing 8022, bladders 8032 and 8042 separated by dividing wall8031. In addition, there are also shown ports 8024, 8028, 8026 and 8029.These bladders 8032, and 8042 are configured to selectively oscillateproducing a pulsed jet reaction which drives the fluid through theheatpipes and around the perimeter of the heatsink ring.

FIG. 85D shows a side cross-sectional view taken along line A-A whichshows bladders 8032, and 8042 as well as body or housing section 8022.There is shown ports 8028 and 8029 as well as ports 8024, and 8026. Inthis view the bladders 8032 and 8042 are shown unmoved, however as shownin FIG. 85E the bladder 8032 is shown oscillating asynchronous (oropposite) to bladder 8042.

Thus, there is shown a compact, system which can selectively transportheat using synthetic jets to the heatsink ring 7018 where heat isdispersed into the atmosphere as the fluid travels under the heatsinkring's fins thereby exhausting he heat generated by driver board 7011and the two LED boards 7020.1 and 7020.2. During severe cold weatherconditions the heat dispersed thru the fins melts any build up ofmoisture, snow, or ice from lens 7009. Cold fluid the returns back tothe hot region to continue the cooling cycle.

Accordingly, while several embodiments of the present invention havebeen shown and described, it is obvious that many changes andmodifications may be made thereunto without departing from the spiritand scope of the invention.

What is claimed is:
 1. A forward cooling headlight comprising: a body(7004); a lens (7009) coupled to said body (7004); a heatsink (7010)coupled to said body (7004); a heatpipe (7030, 7032), at least one light(7024); and wherein said at least one light (7024) is coupled to saidheatsink (7010), and wherein said heatpipe (7030) is coupled to saidheatsink (7010) at a first end and to said body (7004) at a second endwherein said heatsink (7010) draws heat away from said light (7024), andwherein said heatpipe (7030, 7032) draws heat away from said heatsink(7010) and towards said body (7004).
 2. The forward cooling headlight asin claim 1, wherein said body (7004) has a first end which is adjacentto said heatsink (7010) and a second end which is coupled to said lens(7009).
 3. The forward cooling headlight as in claim 1, furthercomprising at least one synthetic jet (7040), wherein said at least onesynthetic jet is coupled to said heatpipe (7030, 7032).
 4. The forwardcooling headlight as in claim 1, further comprising at least oneadditional heatpipe (7032).
 5. The forward cooling headlight as in claim4, further comprising at least one additional synthetic jet (7042)coupled to said at least one additional heatpipe (7032).
 6. The forwardcooling headlight as in claim 5, wherein said heatpipe and saidadditional heatpipe each contain fluid, wherein said at least onesynthetic jet and said at least one additional synthetic jet areconfigured to move said fluid through said heatpipe and said additionalheatpipe respectively.
 7. The forward cooling headlight as in claim 6,wherein the synthetic jet has a bladder configured to expand or contractto drive the fluid through the heatpipe.
 8. The forward coolingheadlight as in claim 1, wherein said body is substantiallysemi-spherical in shape.
 9. The forward cooling headlight as in claim 8,further comprising a circular rim (7008) coupled to the body (7004). 10.The forward cooling headlight as in claim 9, further comprising at leastone additional heatpipe (7032), wherein the circular rim (7008) isformed from a thermally conductive material, and wherein the circularrim (7008) is coupled to at least one of the heatpipe (7030) and theadditional heatpipe (7032).
 11. The forward cooling headlight as inclaim 1, further comprising at least one valve (7029, 7034) coupled tothe heatpipe (7030, 7032), wherein the at least one valve is a one-wayvalve.
 12. The forward cooling headlight as in claim 1, furthercomprising a plurality of light drivers (8002, 8003), comprising a firstlight driver (8002) and a second light driver (8003), and wherein the atleast one light (7024) comprises at least two lights (7024.1 a, 7024.1d), comprising a first light (7024.1 a) and a second light (7024.1 d),wherein said first light driver (8002) is configured to drive said firstlight (7024.1 a) and said second light driver (8003) is configured todrive said second light (7024.1 d).
 13. The forward cooling headlight asin claim 12, wherein said first light (7024.1 a) is an outer light, andsaid second light (7024.1 d) is an inner light, wherein when said firstlight (7024.1 a) is lit, it provides a first focal point and whereinwhen said second light (7024.1 d) is lit, it provides a second focalpoint.
 14. The forward cooling headlight as in claim 12, furthercomprising a driver board (7010), wherein said plurality of lightdrivers (8002, 8003) are disposed on said driver board (7010).
 15. Theforward cooling headlight as in claim 13, further comprising a lightboard (7020), wherein said at least two lights are disposed on saidlight board (7020).
 16. The forward cooling headlight as in claim 15,further comprising an additional light board, wherein a first lightarray (7024.1) comprising said first light (7024.1 a) and said secondlight (7024.1 d) are coupled to said first light board (7020.1) and asecond light array (7024.2) is coupled to said second light board(7020.2).
 17. The forward cooling headlight as in claim 16, wherein saidfirst light array comprises a plurality of lights comprising at leasttwo outer lights and at least one inner light.
 18. The forward coolingheadlight as in claim 17, wherein said second light array comprises aplurality of lights comprising at least two outer lights and at leastone inner light.
 19. The forward cooling headlight as in claim 18,wherein when said inner lights on said first light array and said secondlight array are lit, it creates a substantially singular focal point oflight from the headlight.
 20. The forward cooling headlight as in claim18, wherein when said outer lights on said first array and on saidsecond array are lit, it creates at least two focal points of light fromthe headlight.